"Thermal Contact Resistance in Microelectronic Equipment"

Abstract: In modern microelectronic packages, there are, inevitably, physical, mechanical or metallurgical joints between the integrated circuit chip, or heat source, and the enclosure, or heat sink. This paper presentas a very brief review of the state-of-the-art of thermal contact resistance as applied to microelectronic equipment. The material summarizes analytical methods for determining the spreading resistance in microelectronic packaages; presents techniques to predict, measure, and minimize the contact resistance across mechanical joints; and discusses teh prediction and measurement of the contact resistance of bonded joints in integrated circuit packages.

Thermal Management Concept in Microelectronic Packaging from Component to System, ISHM Technical Monogram, Series 6984-003, 135, 1984.

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