"META - A Conjugate Heat Transfer Model For Air Cooling of Circuit Boards with Arbitrarily Located Heat Sources"

Abstract: A conjugate model for air flow over flat plates with arbitrarily located heat sources is developed based on the integral formulation of the boundary layer equations combined with a finite volume solution which assumes two-dimensional heat flow within the plate. The fluid and solid solutions are coupled through an iterative procedure, allowing a unique temperature profile to be obtained at the fluid-solid interface which simultaneously satisfies the temperature field within each domain. Radiation heat loss is also included in the plate heat transfer. A detailed package moduler is also incorporated within the program framework to allow internal package thermal resistances to be determined and give a detailed thermal description for each package with die plane temperatures. Surface temperature profiles obtained from flat plate circuit board prototypes are used to substantiate the various assumptions inherent in the model and to establish the accuracy of the model for a range of design conditions commonly used in microelectronic applications. Data published in the open literature are also used to show the flexibility of the model to simulate a variety of microelectronic applications. The model is shown to be in good agreement with the experimental data over a wide range of flow conditions and power levels, and good agreement is achieved with experimental data typical of many microelectronic applications.

1991 ASME National Heat Transfer Conference, Heat Transfer in Electronic Equipment, HTD-Vol.171, p117

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