Natural Convection in Microelectronics Enclosures

Develop analytical models for steady-state natural convection from a heated body to its surrounding, cooled enclosure Applicable to a wide range of body and enclosure shapes, aspect ratios, and orientations Applications for design of sealed enclosures for electronics industry Analytical models that will be incorporated into board-level modelling tools, such as META Experimental and numerical data for various 3D enclosure geometries for model validation

Combine conduction and laminar natural convection limiting cases using composite solution technique Uses different body gravity functions at inner and outer boundaries to account for shape and aspect ratio variations Simple model formulation can include radiation and conduction effects Experimental program underway to provide validation data for a wide variety of enclosure geometries

Teertstra, P. and Yovanovich, M. M. (1998), "Comprehensive Review of Natural Convection in Horizontal Circular Annuli," 7th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, June 15 - 18, Albuquerque, NM.