Thermal Vias--Electronics

Develop a fast, accurate, analytical approach to modeling heat transfer in thermal via networks used in removing heat from chips in high density multichip module designs. Mathematical alogrithms for calculating thermal resistance and the special functions required during the calculation procedure

The model makes use of closed form expressions for thermal resistance which may be easily implemented into a general solution procedure The thermal resistance model consists of three closed form expressions for calculating the resistance of the die attach pad, the via pads and the one dimensional resistance in the via itself An overall resistance is obtained for the via island by using a series/parallel combination of thermal resistances

Lee, S., Lemczyk, T.F. and Yovanovich, M.M., 1992, "Analysis of Thermal Vias in High Density Interconnect Technology," Eighth Annual IEEE Semi-Therm Symposium, Austin, TX, February 3-5.