Spreading Resistance in Layers
Thermal Vias
Natural Convection in Enclosures
Advanced Modelling of Low Reynolds Number
      Flow Heat Exchangers

Modeling Thermal Constriction Resistance
       of a Sphere - Layered Substrate in Elastic Contact

Power Electronics:TAPS
Heat Pipes
Circular Annular Fins
Plate Fins
Pin Fins
Optimization Routines
Power Electronics: TAPS

Develop a fast, accurate model for simulating power electronics containment modules, configured with high profile packages such as transformers, magnetic coils, thyristors, diodes and other related electronic devices.
The model should allow designers to perform rapid simulation studies that can lead to parametric optimization of power electronics applications.